Inventor: Chang David D C

Assignee: AT&T Corp

Attorney: Anderson Roderick B; Brown Kenneth M

Title: Electrical test apparatus and method
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 5500605    Publication date : 1996-03-19
Referenced by: 111    Reference cited: 10   
    

Inventor: King Jerrold L; Nevill Leland R
Assignee: Micron Technology, Inc
Attorney: Workman, Nydegger & Seeley
Title: Semiconductor chip package
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 6198172    Publication date : 2001-03-06
Referenced by: 75    Reference cited: 3   
    

Inventor: Barrett Keith E
Assignee: Micron Technology, Inc
Attorney: Trask Britt
Title: Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 6081429    Publication date : 2000-06-27
Referenced by: 66    Reference cited: 20   
    

Inventor: Beckenbaugh William M; Lytle William H; Berman Bernard
Assignee: Motorola, Inc
Attorney: Dover Rennie William; Wolin Harry A
Title: Method of forming contact pads for wafer level testing and burn-in of semiconductor dice
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 5593903    Publication date : 1997-01-14
Referenced by: 64    Reference cited: 4   
    

Inventor: Nolan Charles C; Sahr Stuart
Assignee: Signatone Corporation
Attorney: Castle Linval B
Title: Temperature conditioner for tests of unpackaged semiconductors
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 4845426    Publication date : 1989-07-04
Referenced by: 53    Reference cited: 2